Tsim los ua ib qho eco- lwm txoj hauv kev zoo rau nyiaj cadmium oxide (AgCdO), AgCuO cov khoom sib tiv tauj xa cov hluav taws xob muaj kev ntseeg siab thoob plaws cov kev thov hloov pauv. Tsim los ntawm cov hmoov hlau metallurgy thiab cov txheej txheem oxidation sab hauv, cov khoom no muaj cov tooj liab oxide zoo sib xws hauv cov nyiaj ntshiab matrix. Qhov microstructure no tiv thaiv kev sib cuag, txo cov khoom xa mus thaum lub sij hawm hluav taws xob arcing, thiab ua raws li thoob ntiaj teb RoHS thiab REACH ib puag ncig cov cai.
Formulations & Khoom Qib
AgCuO8 (8% CuO, Balance Ag):Qhov siab tshaj plaws hluav taws xob conductivity thiab qis tshaj pib tiv thaiv. Qhov zoo tshaj plaws rau kev txuas ntxiv siab -tam sim no conduction nrog qhov ntsuas kub tsawg.
AgCuO10 (10% CuO, Balance Ag):Cov qauv sib npaug sib npaug muab qhov siab arc yaig tsis kam thiab thermal stability nyob nruab nrab -lub luag haujlwm hloov mus ua haujlwm.
AgCuO12 (12% CuO, Balance Ag):Kev tiv thaiv siab tshaj plaws rau kev sib cuag vuam thiab cov khoom yaig nyob rau hauv kev hloov pauv kev ntxhov siab thiab siab inrush tam sim no.
Key Performance Advantages
Anti-Vuam kev ua tau zoo:Dispersed oxide theem cuam tshuam cov kua nyiaj bridging thaum lub sij hawm siab -tam sim no arcing, tiv thaiv kev sib cuag qaug dab peg nyob rau hauv luv luv - Circuit Court tej yam kev mob.
Tswj Arc Erosion:Uniform particle distribution disperses thermal stress, minimizing localized pitting thiab extending mechanical switching life.
Environmental Compliance:100%.
Thermal Management:Tuav qis kev ua haujlwm kub nyob rau hauv cov ntsuas tsis tu ncua tam sim no, tiv thaiv sab hauv actuator springs los ntawm tshav kub degradation.
Engineering Specifications
|
Parameter |
AgCuO 8 |
AgCuO10 |
AgCuO12 |
Kev xeem Standard |
|
Cov ntsiab lus CuO (wt%) |
8.0% |
10.0% |
12.0% |
Tshuaj ntsuam xyuas |
|
Qhov ceev (g / cm³) |
Ntau dua lossis sib npaug rau 10.1 |
Ntau dua lossis sib npaug rau 9.9 |
Ntau dua lossis sib npaug rau 9.8 |
Txoj kev Archimedes |
|
Hluav taws xob conductivity (MS / m) |
Ntau dua lossis sib npaug rau 48.0 |
Ntau dua lossis sib npaug rau 42.0 |
Ntau dua lossis sib npaug rau 38.0 |
Eddy Tam sim no |
|
Hardness (HV) |
75 - 105 |
85 - 120 |
95 - 130 |
Micro-Vickers |
|
Shear Strength (Bimetal Txheej) |
Ntau dua lossis sib npaug li 180 MPa |
Ntau dua lossis sib npaug li 180 MPa |
Ntau dua lossis sib npaug li 180 MPa |
ASTM B565, ASTM B565 |
|
CuO Particle Loj |
Tsawg dua los yog sib npaug li 3 um |
Tsawg dua los yog sib npaug li 3 um |
Tsawg dua los yog sib npaug li 3 um |
Metallographic |
|
Dimensional kam rau ua (L x W) |
+/{1}} hli |
+/{1}} hli |
+/{1}} hli |
Optical Micrometer |
|
Thickness kam rau ua |
+/{1}} hli |
+/{1}} hli |
+/{1}} hli |
Ntsuas Thaiv |
Cov Qauv Qauv & Geometry
Khoom Monometal Flat Chips:Ntev: 2.0 - 25.0 mm|Dav: 2.0 - 20.0 hli|Thickness: 0.5 - 4.0 hli. Tsim nyog rau tus qauv tsis kam lossis induction brazing rau tooj dag thiab tooj liab terminals.
Radiused Profile Sab saum toj Chips:Spherical Radius: R 5.0 - R 50.0 mm. Guarantees tau txhais kev sib cuag kev sib raug zoo nyob rau hauv mechanical actuation tolerances.
Bimetal Tri- Txheej Chips:Sab saum toj ua haujlwm AgCuO txheej (30% -70% thickness) sib koom ua ke rau cov txheej txheem tooj liab ntshiab kom ua tau zoo brazing thiab qis dua cov ntsiab lus hlau muaj nuj nqis.
Cov ntawv thov kev lag luam
Moulded Case Circuit Breakers (MCCB):Cov ntsiab lus tseem ceeb ntawm kev sib cuag rau 63A txog 800A Circuit Court tiv thaiv lub luag haujlwm.
AC Contactors:Lub zog hloov hluav taws xob ua haujlwm rau AC-3 thiab AC-4 lub cev hloov pauv pawg.
Miniature Circuit Breakers (MCB):Arc- tiv taus tiv tauj rau kev lag luam thiab kev lag luam cuam tshuam tam sim no modules.
Hnyav-Lub Hwj Chim Lub Hwj Chim Relays:Tswj relays khiav hauj lwm nyob rau hauv siab capacitive los yog inductive load switching cycles.
Customization & Secondary ua
Layer Depth Ratios:AgCuO haumxeeb txheej customizable los ntawm 0.3 hli mus rau 2.5 hli; tooj liab backing adjustable ntawm 0.2 hli mus rau 2.0 hli.
Backside Brazing Txheej:Muaj nrog cov nyiaj dawb huv rov qab (2 - 10 um), tooj liab thaub qab, lossis ua ntej-fluxed silver brazing alloy coatings (Ag-Cu-Zn-Sn).
Surface Locating Features:Flatness tswj tsis pub dhau 0.015 hli; xaiv qhov chaw dimples, hla -grooves, los yog kev sib tw tabs rau kev xaiv automated-thiab- qhov chaw tso.
Additive Modifications:Kev suav nrog cov oxides theem nrab (In2O3, WO3, lossis Bi2O3 ntawm 0.1% -0.5% qhov hnyav) txhawm rau txhim kho arc txav thiab tiv thaiv tus cwj pwm.
Quality Assurance & Verification
Microstructure Analysis:Hla -sectional metallography lees paub oxide particle tis, matrix homogeneity, thiab interfacial bond integrity.
Elemental & Density Verification:X-Ray Fluorescence (XRF) txheeb xyuas cov nyiaj tiag tiag- rau- tooj liab piv; hydro- kev ntsuam xyuas qhov ntom ntom kom ntseeg tau tias kev sib khi zoo.
Mechanical Bond Testing:Micro-Vickers hardness charting thiab destructive shear testing guarantee bimetal txheej zog.
Automated Optical Inspection (AOI):100% pom qhov system kuaj pom ntug burrs (<= 0.02 mm), dimensional variances, and surface defects.
Ntim & Logistics
Vacuum Sealed Barrier Bags:Ntxuav-chav ntim hauv lub tshuab nqus tsev-cov hnab ntim polyethylene kaw nrog cov desiccant los tiv thaiv oxidation atmospheric.
Daim kab xev & Reel Feed Ntim:Optional antistatic carrier daim kab xev reels raws siab - ceev automated los ua ke kab.
Traceability Labeling:Txhua pob qhia cov ntaub ntawv barcoded batch txuas nrog cov ntaub ntawv raw cov ntaub ntawv kub, sintering khiav cav, thiab daim ntawv pov thawj tshuaj xyuas.
Cov lus nug nquag
Cim npe nrov: Tuam Tshoj silver tooj liab oxide hu chips manufacturers, lwm tus neeg
