Hauj lwm lawm

Xa kev nug

Cov nyiaj npib tsib xee (AgNi) cov chips sib txuas ua ke cov nyiaj hluav taws xob siab nrog cov npib tsib xee tiv thaiv arc yaig thiab kev sib cuag vuam. Lawv muaj kev sib cuag tsis tshua muaj zog thiab ruaj khov hloov kev ua tau zoo hla qis- mus rau - nruab nrab hluav taws xob loads (feem ntau mus txog 100A AC / DC, nyob ntawm kev sib cuag geometry thiab kev hloov pauv).

Kev xaiv khoom

Qib	Ag/Ni Ratio	Hluav taws xob conductivity	Hardness (HV)
AgNi 10	90 / 10	50-54 MS / m	60 – 90
AgNi15	85 / 15	45-49 MS / m	70 – 100
AgNi 20	80 / 20	41-45 MS / m	80 – 120
AgNi 30	70 / 30	38-41 MS / m	90 – 140

Khoom zoo

Kev tiv tauj qis:Minimizes localized resistive cua sov thiab voltage poob tshaj txuas hluav taws xob lub luag hauj lwm cycles.

Arc Erosion Control:Uniformly dispersed nplua nickel hais txo vaporization thiab arc txav thaum lub sij hawm qhib Circuit Court.

Anti-Vuam tiv thaiv:Pab tiv thaiv kev sib cuag fusing tshwm sim los ntawm lub sijhawm tam sim no spikes thiab arcing.

Formability:Khaws cov ductility tsim nyog rau siab - stamping ceev, nplua - blanking, thiab ncaj qha txias- nqe lus (tshwj xeeb tshaj yog rau qib AgNi10 thiab AgNi15).

Dimensions & Structures

Parameter	Flat Rectangular Chips	Profiled / Domed Chips	Clad / Bimetal Strips
Ntev / Dav	1.5mm-12.0 hli	1.5mm-10.0 hli	Nruam coils los yog txiav - mus rau -ntev
Thickness	0.2 hli - 2.5mm	0.3mm-3.0 hli	Tag nrho cov thickness: 0.2mm-2.0mm
Cov Txheej Txheem Ua Haujlwm	100% AgNi alloy	100% AgNi alloy	10% - 50% AgNi ntawm Cu / CuNi substrate
Kev xaiv tshwj xeeb	Radiused / Chamfered npoo	Curvature: R2.0mm - R15.0mm	Ua ntej- siv brazing alloy (0.03mm - 0.08mm)

Technical Performance Indicators

Khoom	Engineering Specification	Kev xeem Standard
Qhov ntom	9.8-10.3g / cm³	Hydrostatic hnyav
Shear Strength (Clad Bond)	Ntau dua lossis sib npaug li 150 MPa	Tensile shear xeem
Dimensional kam rau ua	Ntev / Dav: ± 0.02mm\|Thickness: ± 0.01 hli	Optical duab ntsuas
Txheej Thickness kam rau ua	± 0.005 hli	Metallurgical cross-section SEM
Max Burr Qhov siab	Tsawg dua los yog sib npaug li 0.01mm	Tsis yog -hu rau laser profile ntsuas
Kev khiav hauj lwm Temp.	Txog li 150 degree	Thermal aging test

Tej kev siv

Tswj Relays:Automotive PCB relays, teeb liab keyboards, miniature tswj relays.

Circuit Breakers:Miniature Circuit Breakers (MCB) thiab Residual Current Devices (RCD).

Industrial Switching:AC contactors (feem ntau mus txog 40A nyob), lub cev muaj zog pib, txwv hloov pauv.

Cov Khoom Siv Hluav Taws Xob:Thermostats, cov cuab yeej siv hluav taws xob ua rau, phab ntsa hloov, timers.

Custom Manufacturing Options

Bimetal Configurations:Ib leeg-sab cladding, ob-sab cladding, sab saum toj-ntev, lossis inlaid strip geometry.

Kev kho deg:Passivated anti-tarnish tiav, xaiv kub flash (0.1µm - 0.5µm), lossis nyiaj plating.

Hom khoom siv:Loose bulk Cheebtsam, daim kab xev-thiab-reel ntim rau automated SMT qhov chaw, los yog txuas txuas ntxiv.

Kev them nyiaj yug Engineering:Kev cai cuab yeej thiab cov duab tsim raws li cov neeg siv khoom engineering kos duab (STEP, DWG, PDF).

Cov txheej txheem kev pov hwm zoo

Bond Integrity:100%.

Muaj pes tsawg leeg & Microstructure:Optical emission spectroscopy thiab SEM txheeb xyuas cov nickel particle dispersion thiab nyiaj purity (Ntau dua lossis sib npaug rau 99.95%).

Automated Dimensional Inspection:Optical vision systems txheeb xyuas 100% ntawm qhov tseem ceeb ntawm qhov ntev thiab ntug burr thresholds.

Batch Lot Testing:Micro- hardness, shear zog, thiab kev tiv thaiv tiv thaiv kev txheeb xyuas ib qho kev khiav haujlwm.

Kev Tiv Thaiv Ntim & Logistics

Nqus Barrier:Muab ntim rau hauv ESD-kev nyab xeeb noo noo- lub hnab thaiv cov khoom uas muaj cov tshuaj desiccants thiab cov ntawv qhia cov av noo.

Inert Gas Flushing:Secondary ntim purged nrog nitrogen gas los tiv thaiv tarnish thaum dej hiav txwv hla.

Traceability:Barcoded txheej cartons teev cov xov tooj cua sov, batch kom muaj nuj nqis, hnub tsim khoom, thiab daim ntawv pov thawj tshuaj xyuas.

Cov lus nug nquag

Q: AgNi piv rau AgCdO li cas hauv kev hloov pauv?

A: AgNi muab qhov sib piv arc yaig tsis kam thiab tiv thaiv kev ruaj ntseg yam tsis siv tshuaj lom cadmium, ua kom muaj kev ua raws li RoHS thiab REACH cov cai.

Q: Kuv yuav xaiv li cas ntawm AgNi10 thiab AgNi30 rau kuv daim ntawv thov?

A: Xaiv AgNi10 rau qis-kev tiv tauj- quab yuam daim ntawv thov uas yuav tsum tau muaj kev ua haujlwm siab thiab tsis muaj zog; xaiv AgNi30 rau siab -inductance switching loads qhov twg arc yaig thiab kev sib cuag vuam yog cov kev txhawj xeeb tseem ceeb.

Q: Yuav ua li cas koom nrog txoj kev tsim nyog rau kev txuas AgNi chips rau tooj liab terminals?

A: AgNi tiv tauj daim ntawv cog lus ncaj qha rau tooj liab, tooj dag, lossis tooj liab substrates ntawm kev siv vuam, laser vuam, lossis induction brazing.

Q: Lub neej txee ntawm passivated AgNi tiv tauj chips yog dab tsi?

A: Muab khaws cia rau hauv cov khoom ntim uas tsis tau qhib lub tshuab nqus tsev nyob rau hauv kev nyab xeeb- tswj cov xwm txheej (kub qis dua 25 degree, av noo qis dua 60%), cov chips passivated tseem tarnish-dawb thiab npaj rau vuam / brazing txog li 12 lub hlis. Thaum qhib, cov chips yuav tsum tau ua tiav sai lossis rov ntim dua hauv cov roj inert.

Cim npe nrov: Tuam Tshoj silver nickel contact chips manufacturers, lwm tus neeg