Silver Alloy Contact Chips Rau Hloov

Precision-engineered los ntawm hmoov metallurgy, sab hauv oxidation, thiab txias - cov txheej txheem, cov nyiaj hlau alloy hu ua chips ua haujlwm raws li thawj tam sim no - nqa thiab arc- tua cov ntsiab lus hauv qis - mus rau - cov khoom siv hluav taws xob nruab nrab. Ua ke cov nyiaj zoo nrog cov txheej txheem tawg xws li npib tsib xee lossis hlau oxides, lawv xa cov hluav taws xob tsis zoo, tiv thaiv- vuam cov khoom, thiab arc yaig tsis kam nyob rau hauv qhov kev hloov pauv tam sim no. Muaj nyob rau hauv cov khoom, bimetal, thiab tri{10}}hlau profiles, cov chips no yog tsim rau phab ntsa keyboards, relays, microswitches, me me Circuit Court breakers (MCBs), thiab industrial pushbuttons.

AgCdO (88/12, 90/10):Muab kev tiv thaiv zoo tshaj - vuam muaj peev xwm thiab ruaj khov kev tiv thaiv hla hnyav - lub luag haujlwm AC tam sim no cuam tshuam.

AgSnO2 (90/10):Kev ua raws li ib puag ncig, cadmium- kev xaiv pub dawb nrog thermal stability, tsis tshua muaj cov khoom xa mus, thiab siab arc yaig kuj nyob rau hauv inductive loads.

AgNi (90/10, 80/20):High hluav taws xob conductivity ua ke nrog zoo heev ductile workability, zoo tagnrho rau nruab nrab loads thiab siab switching frequencies.

AgZnO (92/8):Nta ceev arc -extinguishing yam ntxwv thiab tsis tshua muaj suab nrov switching, haum rau tsev neeg switches thiab lub teeb industrial contactors.

Nyiaj zoo (99.9% Ag) / AgCu:Tsawg pib tiv thaiv rau qis-voltage circuits xav tau qhov tsawg kawg nkaus voltage poob thiab micro-load switching.

Khoom Disc & Square Chips:Thickness ntawm 0.3 hli mus rau 3.5 hli; txoj kab uas hla / dav ntawm 1.5mm txog 12.0mm.

Bimetal Composite Chips:Sab saum toj Ag alloy txheej (0.15–1.2 mm) txias-welded rau Cu puag txheej (0.3–2.5 mm) kom ua kom zoo dua cov khoom siv hlau zoo.

Tri- Hlau strips:Ag alloy / Cu / Ag alloy lossis Ag alloy / Cu / Ni txheej txheej txheej tsim los rau siab - ceev nruam stamping ua haujlwm.

Nto Contours:Spherical sab saum toj lub vojvoog xaiv los ntawm R2.0 mm txog R15.0 mm; Cov chaw tiaj tus hauv av mus rau qhov chaw roughness Ra Tsawg dua lossis sib npaug li 0.4 µm.

Brazing-Nyob thaub qab:Rov qab sab ua ntej-coated nrog Ag-Cu-Zn solder lossis 2.0–5.0 micron ntshiab Ni txheej rau cov kab sib txuas ua ke.

Arc Thermal Suppression:Dispersed oxide theem nqus lub zog thaum sib cuag sib cais, txo qhov chaw thermal pooling.

Tsawg ua haujlwm tsis kam:High-purity silver matrix tswj kev tiv thaiv qis dua 1.5 micro-ohms raws li tus qauv ntsuas kev sib cuag.

Anti-Fusing Properties:Composite theem teeb meem impede nto thermal vuam thaum lub sij hawm lub sij hawm ncov tshaj overloads los yog luv luv circuits.

Kev ua haujlwm siab ua haujlwm siab:Microstructure- txhawb nqa matrix txhawb nqa txog 100,000 lub voj voog hloov pauv raws li kev khiav hauj lwm thiab kev thauj khoom.

Chaw Nyob & Tsev Tswj Xyuas:Rocker keyboards, dimmer modules, phab ntsa sockets, lub teeb hloov.

Industrial Automation:Pushbuttons, txwv keyboards, selector keyboards, tswj thaum muaj xwm ceev nres.

Automotive & Appliance Systems:Fais fab qhov rais tswj, oob khab relays, thermostats, microswitches.

Cov cuab yeej tiv thaiv hluav taws xob:Miniature Circuit Breakers (MCBs), cov khoom siv tam sim no (RCDs), lub cev muaj zog pib.

Tight Precision Tolerances:Sizing muaj rau ± 0.008 hli rau siab - ceev automated sorting thiab sib dhos khoom.

Microstructure Engineering:Kev cai oxide particle dispersion (100 nm txog 2.0 microns) thiab Ag feem pua ​​​​ntawm 60% mus rau 99.99%.

Kev xaiv nto plating:Rov qab-sab nyiaj flash (1.0 - 3.0 µm), nickel undercoating (2.0 - 5.0 µm), lossis liab qab ci zeb tiav.

Kev cai CAD Profiles:Kev cai geometries tsim ncaj qha los ntawm cov neeg siv khoom STEP, IGES, DXF, lossis DWG cov ntaub ntawv.

Flexible Cladding Ratios:Silver txheej thickness adjustable ntawm 10% thiab 60% ntawm tag nrho cov khoom thickness.

Compositional Analysis:Melt ntau chemistry txheeb xyuas ntawm Inductively Coupled Plasma Optical Emission Spectrometry.

Kev tshuaj xyuas microstructure:Optical metallography txheeb xyuas oxide particle faib, grain ciam ceev, thiab cladding interface kev ncaj ncees.

Kev Ntsuam Xyuas Kev Ncaj Ncees Interface:Kev ntsuam xyuas cov tshuab txiav tau ua txhua 5,000 units los lav xoom txheej delamination.

Ultrasonic Defect Detection:Kev tshuaj ntsuam acoustic microscopy kuaj pom cov voids sab hauv, micro- tawg, lossis kev sib txuas qhov tsis sib haum mus txog 0.05 mm.

100% Optical Sorting:Cov tshuab tsis pom kev tsis pom kev tshawb xyuas qhov ntev, qhov chaw burrs, discoloration, thiab cov qauv deformation ua ntej packing.

Nitrogen Vacuum Protection:Muab ntim rau hauv los tiv thaiv- zoo li qub, noo noo- cov hnab ntim khoom ntim nrog cov roj nitrogen tsis muaj zog los tiv thaiv tarnish thiab oxidation.

Kev sib xyaw desiccant:Silica gel inserts tuav cov txheeb ze ntawm cov av qis dua 10% thoob plaws hauv kev thauj mus los ntev.

Carrier Daim kab xev:Muaj nyob rau hauv tus qauv cab kuj tapes (8 hli - 32 hli) rau kev xaiv ncaj qha-thiab- qhov chaw nto mount los ua ke.

Traceability ntau:Cov ntawv cim barcodes suav nrog batch naj npawb, tshav kub code, qhov ntev, qhov ntau, thiab sijhawm soj ntsuam.

Cov ntaub ntawv ua raws:Xa nrog tag nrho cov ntawv pov thawj kev tshuaj xyuas metallurgical ua raws li cov qauv kev thauj mus los thoob ntiaj teb huab cua thiab hiav txwv.

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